The company has grown since then to more than employees today. Our products help increase production efficiency, optimize processes and. The microDICE™ laser micromachining system leverages TLS-Dicing™.

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Innovative laser processes are revolutionizing industrial manufacturing worldwide. They are characterized by extraordinary reliability and productivity, fine precision, and flexibility. It is only because of our laser processes that efficient series production of new and innovative components and products are made possible.

Cost, quality and throughput are major factors in achieving successful manufacturing in the semiconductor industry. With the growing adoption of new types of wafer substrates, thinner wafers and scaling to smaller dimensions and larger-size substrates, wafer dicing is evolving as a critical value-add process step that not only ensures, but also further enhances, semiconductor mcromac yields.

At the same time, traditional scaling of feature sizes in microelectronics is becoming increasingly cost prohibitive in order to add micromsc functionality on devices within a smaller footprint. As a result, chip manufacturers micromzc turning toward vertical stacking of devices and heterogenous integration 3s to enable smaller, higher-performance devices. This has created a greater need for methods of processing surface layers of the device without affecting buried structures, as well as selective exposure of functional areas on the device.

Its high throughput, outstanding edge quality and mm wafer capable platform enables a true high-volume production process, especially for SiC-based devices. This results in up to 15X lower cost of ownership over the entire life-time of the dicing system.


The system features a line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing, as well as three optional wavelength lasers near micrmoac, green and ultravioletresulting in a highly flexible, high-quality laser annealing platform. Microstructure diagnostics and failure analyses are pivotal for the ongoing improvement of functional materials and sophisticated electronic components.

Mciromac lasers are well established tools in manifold applications, they have been broadly ignored for use in sample preparation due to concerns regarding their potential for causing structural damage.

Today, however, the use of ultrashort pulses and optimized processing routes is addressing these concerns and enabling laser processing to finally enter the scene — speeding micromacc microstructure diagnostics and failure analysis as well as opening up access to deeply buried structures and large-area preparation.

As the first stand-alone, ultrashort pulsed laser-based tool for sample preparation, the microPREP systems bring additional unique capabilities, such as enabling large-area and 3D-shape sampling to allow for more comprehensive testing of complex structures. The microPREP systems an be used for a variety of sample preparation techniques like SEM inspection of advanced-packaging devices, X-ray microscopy, atom probe micromsc, and micro mechanics. The constant cost pressure in the photovoltaic industry as a continues challenge to solar cell manufacturers can only be solved 3f increasing cell efficiency with simultaneous reducing manufacturing costs.

3D-Micromac Celebrates 15 Years, Opens New Building | Business | Oct |

For this reason, 3D-Micromac continuously works on innovative laser processes and solutions for optimizing manufacturing processes, productivity, and effectiveness of silicon solar cells. Besides the integration of laser processing, also printing and coating techniques can be integrated.


Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the mass production of crystalline solar cells. The contactless cell handling enables processing without surface defects and microcracks. The separated cells show a significantly higher mechanical strength, better edge quality and a lower power reduction compared to laser scribing and breaking approaches.

3D-Micromac – Micromachining Excellence

The on-the-fly processing guarantees highest productivity and an outstanding price-performance ratio. In addition, 3D-Micromac has a fully equipped application laboratory with experienced process engineers to support customers in feasibility tests, process development, and realization of customized solutions.

Micfomac immensely helps to reduce ramp-up times in production. Brittle-rigid materials such as glass, ceramic and sapphire have excellent material properties that make them indispensible for use in the production of electronics.

Areas of use include smartphone displays made of chemically or thermally hardened glass, camera casings or watch glasses made of sapphire glass, but also LEDs and OLEDs. All methods comply with the requirements of industrial display production and guarantee clean and gentle processing, without any discoloration of the material, and excellent edge quality and breakage resistance.

Production Solutions for Innovators and Growth Markets. Microdiagnostics and Failure Analysis.

Micromachining Excellence

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