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This benefit, combined with the datashet switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D-Pak is designed for surface mounting using vapor phase, infrared, or wave soldering techniques.

FRN Datasheet, PDF – Qdatasheet

The straight lead version IRFU series is for through- hole mounting applications. Power dissipation levels up to 1.


The D-Pak is designed for surface mounting using. The straight lead version IRFU series is for through. Soldering Temperature, for 10 seconds. Q g Total Gate Charge.

Q gs Gate-to-Source Charge. DataS Q he gd et4U. L D Internal Drain Inductance. L S Internal Source Inductance.

C iss Input Capacitance. C oss Output Capacitance. C rss Reverse Transfer Capacitance. Source-Drain Ratings and Characteristics. I S Continuous Source Current.

FR9024N Datasheet PDF – International Rectifier

Q rr Reverse Recovery Charge. For recommended footprint and soldering techniques refer to application note AN International Rectifier Electronic Components Datasheet.

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